ASML, Applied Materials and KLA Strengthen eBeam Inspection Landscape as Market Heads Toward USD 1.42 Billion
ASML and imec announced a strategic partnership on March 11, 2025, covering 0.55 NA EUV, 0.33 NA EUV, YieldStar optical metrology, and HMI single- and multi-beam technologies. The development highlights how electron-beam inspection is becoming part of the broader process-control toolkit as semiconductor manufacturers move toward increasingly complex three-dimensional device structures. The 3D Device eBeam Market is projected to increase from USD 598.0 million in 2026 to USD 1,420.0 million by 2036, advancing at a 9.0% CAGR during the forecast period. The market reached USD 548.6 million in 2025 as fabs expanded qualification work across 3D NAND, gate-all-around devices, and advanced packaging. Get Detailed Market Forecasts, Competitive Benchmarking, and Pricing Trends : https://www.factmr.com/connectus/sample?flag=S&rep_id=16051 Why is eBeam inspection becoming more important for 3D devices? Three-dimensional semiconductor structures create inspection problems that optical s...